Are you an aspiring student in the STEM fields looking for a golden opportunity to advance your education in Korea? The POSCO TJ Park Foundation is thrilled to announce the 2025 POSCO Asia Fellowship (PAF) Program, designed specifically for brilliant minds like yours.
This prestigious program seeks to mold the next generation of global leaders by supporting Master’s and Doctoral studies in Korea’s top universities.
Who Can Apply?
The PAF program is looking for candidates who:
- Have completed their bachelor’s degree or higher.
- Demonstrate potential to become a leader in their home country.
- Are planning to enroll in one of the nine prestigious Korean graduate schools(https://postf.recruiter.co.kr/app/jobnotice/view?systemKindCode=MRS2&jobnoticeSn=176210&fbclid=IwZXh0bgNhZW0CMTEAAR1k6XxPsWzDT7YBSR1kB3YpTgBxnqGRBJyAn_K2qRsCgIAGwsl0XzSThzU_aem_AceqLKErN7458c6T0C7UPZYZooXSo92ZRINHALrn0po0osERra3pNYZ0IblazqyLstG3ltgRgpnJvwZUvuRyGVEL) either the Spring or Fall semester of 2025.
- Intend to major in a STEM (Science, Technology, Engineering, Mathematics) field.
Eligibility Requirements
- Nationality: Must be a citizen of an Asian country. Individuals from non-Asian countries or Korea are not eligible.
- English Proficiency: English language proficiency is a must, unless you graduated from a university in Australia, Canada, New Zealand, the USA, or the UK. Accepted tests include TOEFL, TOEIC, TEPS, and IELTS, taken after May 1, 2022.
- Minimum GPA: 2.7 out of 4.0, or equivalent.
Benefits of the Fellowship
The POSCO Asia Fellowship offers substantial benefits that cover tuition, living expenses, and more, to ensure that you can focus fully on your studies without financial worry
How to Apply
To apply for the fellowship, follow these steps:
- Visit POSCO TJ Park Foundation Application Portal (https://postf.recruiter.co.kr/app/applicant/registResume?jobnoticeSn=176210&systemKindCode=MRS2) during the application period.
- Complete your application and upload all necessary documents online.
Application Deadline: 31 May, 2024.
